features low profile package ideal for automated placement ultrafast reverse recovery time low power losses, high efficiency low forward voltage drop high surge capability high temperature soldering 260 /10 seconds at terminals mechanical date case: jedec do-214ab molded plastic body over glass passivated chip terminals: solder plated, solderable per j-std-002b and jesd22-b102d polarit y : laser band denotes cathode end y maximum ratings & thermal characteristics (t a = 25 c unless otherwise noted) note 1: mounted on p.c.b. with 0.55 0.55'' ( 14 14 mm ) copper pad areas. electrical characteristics (t a = 25 c unless otherwise noted) note 2: pulse test:300 s pulse width,1% duty cycle. SK85~86 0.50 0.55 0.70 reverse current v r =v dc t a =25 i r 1 instantaneous forward voltage ma t a =100 10 20 sk88~810 unit i f =8.0a (2) v f 0.85 v items test conditions symbol thermal resistance from junction to lead (1) r jl 20 sk82~83 sk84 /w operating junction and storage temperature range t j t stg ?65 to +125 peak forward surge current 8.3 ms single half sine-wave superimposed on rated load i fsm 200 a voltage rate of change (rated v r ) dv/dt 10000 v/s 60 80 100 v 20 30 40 maximum average forward rectified current i f(av) 8.0 a 42 56 70 v maximum dc blocking voltage v dc 50 60 80 100 v maximum rms voltage v rms 14 21 28 35 sk86 sk88 sk810 unit maximum repetitive peak reverse voltage v rrm 20 30 40 50 items symbol sk82 sk83 sk84 SK85 sk82 thru sk810 sur f ace mount schottk y barrier rectifier reverse v oltage - 20 to 100 v olts forward current - 8.0 amperes www.shunyegroup.com.cn
characteristic curves (t a =25 unless otherwise noted) www.shunyegroup.com.cn
|
